Vacuum robot is a robot that operates in a vacuum environment and is mainly used in the semiconductor industry to realize the transmission of wafers in a vacuum chamber.
Vacuum manipulators are difficult to import, restricted, big demand, and versatile, which has become a key component that restricts the research and development progress of semiconductor equipment and the competitiveness of the whole machine.
Moreover, foreign countries have severely reviewed Chinese buyers and attributed them to the embargoed product catalogue. Vacuum manipulators have become a “bottlenecks” problem that seriously restricts the manufacture of semiconductor equipment in China.
The direct drive vacuum robot technology belongs to the original innovative technology.
Key technologies include:
(1) New configuration design technology of vacuum robot
Through structural analysis and optimization design, avoiding international patents, designing new configurations to meet the requirements of vacuum robots for stiffness and expansion ratio;
(2) Large gap vacuum direct drive motor technology
It involves large gap vacuum direct drive motor and high clean direct drive motor to carry out motor theoretical analysis, structural design, manufacturing process, motor material surface treatment, low speed and large torque control, small multi-axis drive and so on.
(3) Design of multi-axis precision shafting system under vacuum environment
The design of the shaft in the shaft is used to reduce the problem of dissimilarity between the axes and the inertia of the inertia.
(4) Dynamic trajectory correction technology
The offset between the reference position between the wafer and the finger is detected by the fusion of the sensor information and the robot motion information.
By dynamically correcting the motion trajectory, the robot is guaranteed to accurately transfer the wafer from one station in the vacuum chamber to another.
(5) Vacuum robot language conforming to SEMI standards
The vacuum robot-specific language is completed according to vacuum robot handling requirements, robot operation characteristics, and SEMI standards.
(6) Reliability System Engineering Technology
In IC manufacturing, equipment failure can cause huge losses.
According to the high requirements of MCBF for semiconductor equipment, the reliability of each component is tested, evaluated and controlled to improve the reliability of each component of the robot, thus ensuring that the robot meets the high requirements of IC manufacturing.